In the future, in tandem with emerging technologies such as third-generation semiconductors, EVs, and 5G, Taiwan Asahi Diamond also plans to develop corresponding tools to empower customers in achieving the best performance and precision of their products, presenting a compelling opportunity and challenge to advance their technological capabilities.

Taiwan Asahi Diamond’s glass wafer processing tools for semiconductor applications, from casting ingots, trimming, slicing, grinding, cutting, and polishing in the semiconductor process to pre-packaging, Taiwan Asahi Diamond’s products can fully meet the processing needs of the industry.