Feature
- With an emphasis on cutting performance, smooth surface on the edge.
- Superior wear resistance, reduce the cost and time.
- Achieves high productivity and superb dicing results.
| Case Study | |
| Specification | WH253JM-T4-030090 (Electroforming Bond) |
| Size | 55.58D-0.03T-19.05H-0.9L |
| Material | Si wafer |
• Other sizes available upon request.
More information:
