Precision Cutting Wheels-Hubless Type

Processing Method｜

Applications｜

Hubless Dicing Blades

Hubless Dicing Blades are used for cutting electronic materials.

The blades can also be used with special materials, such as ceramic substrates with silicone gel.

Processing Material | Silicon for semiconductor and compound wafers

Processing Method｜

Applications｜

Processing Method｜

Applications｜

From Cutting to Grinding, From EV to Semi

The Harder material You process,
The More experience TDC have.