Dear Friends,
We are pleased to invite you to join us at SEMICON Taiwan 2024.
This exhibition will showcase our latest innovative products.
Visit our booth (J2256) to discover more about our high-precision diamond tools.
Highlights of Our Exhibition:
- SOI Wafer Edge Grinding Wheels
- Glass Wafer Back Grinding Wheels
- Monocrystalline and Polycrystalline Cutting Tools for Probes
- Grinding Wheels for PLP Packaging
- SiC Wafer Processing Wheels: M-cloud
- Dicing Blade: M! Blade
Exhibition Details:
- Exhibition Dates: September 4-6, 2024
- Venue: #J2256 TaiNEX 1, Taipei
We look forward to seeing you at SEMICON Taiwan 2024 to discuss the latest technologies and industry trends!
Our Vision
Providing Eco-Saving, Environmental-Friendly High Precision Diamond Tools